Papers on "Copper Electroplating" and similar term paper topics

Paper #003003 :: Copper Electroplating
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Written in 2001; 1,380 words; 18 sources; $ 46.95

Paper Summary:

This paper introduces the compositions and operating parameters of cyanide and acid copper plating baths. The advantages and limitations of two electroplated copper interconnection methods are compared. Furthermore, a state of the art copper electroplating technique, namely, super filling copper plating, is investigated. Finally possible research endeavors to extend this technique are rendered.
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From the Paper:

" Copper (Cu) is one of most commonly used pure metals in the electrical industry. This is because that copper has a low conduct resistivity (about 6?10-8W-m), which is fit for the low resistivity electrical connections. There are various methods to deposit Cu film; for example, ECD1 (electroplating and electroless plating), PVD2 (sputtering and evaporation) and sometimes CVD methods3 can be used. Among these techniques, electroplating is the one with the least cost and the highest deposition rate which can be controlled properly by varying the applied current. Most important of all, the thickness of the copper coating deposited by the electroplating can be as high as several centimeters (such as in the electro-forming technology). Because of these advantages, the copper electroplating attracts a lot of interests in the microelectronic fabrications in recent years."

Tags: copper electroplating fabrication micro

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