Papers on "Chemical Mechanical Polishing of Copper" and similar term paper topics

Paper #024013 :: Chemical Mechanical Polishing of Copper
Buy and instantly download this paper now

An introduction to the general procedure of a chemical mechanical polishing process for copper.

Written in 2002; 2,209 words; 27 sources; APA; $ 68.95

Paper Summary:

This paper discusses how Chemical Mechanical Planarization (CMP) is one of the most effective methods in achieving adequate local and global surface planarization and how chemical mechanical polishing of copper attracts a lot of interest. It examines the effects of different factors including the slurry, polishing pads and down force etc. on the quality of planarized copper layer in CMP Cu. It also presents, a new CMP copper technique with the name of "Abrasive-free polishing (AFP)".

Outline
Introduction to CMP and CMP Copper(Cu)
Techniques of CMP copper
Removal Mechanism
Slurry-- Chemistry
Slurry-Abrasives Particles
Processing Factors
Polishing Pads
Abrasive-Free Polishing of Copper-a New Technique
Conclusions

From the Paper:

"Recent years have witnessed the rapid development of using copper (Cu) for low resistivity electrical connections in microelectronic devices.1,2 In fact, copper is one of most commonly used pure metals in the electrical industry because of its low conduct resistivity of about 6'10-8W-m and excellent mechanical properties as well. There are various methods to deposit Cu thin films, for example, electroplating, electroless plating, sputtering and thermal evaporation can be used.3.4 The copper thin films achieved by these techniques, especially those from the electrochemical techniques, are not planar enough to promise a successful multilevel interconnection. However, in fabrication of a logic device with five or more layers, at least one layer should be perfectly planar. Lack of layer planarity may lead to severe problems for photo-lithography (such as insufficient focus depth) and dry etching in sub 0.5 mm 5. Chemical Mechanical Planarization (CMP) is one of the most effective methods in achieving adequate local and global surface planarization.6 Therefore, chemical mechanical polishing of copper attracts a lot of interests in recent years."

Tags: cmp afp films slurry

More papers on "Chemical Mechanical Polishing of Copper"

1. Paper #003075 :: Chemical Mechanical Planarization ( 2,431 words; 26 sources; )
2. Paper #090579 :: The Origins of The Mechanical Clock ( 1,350 words; 4 sources; )
3. Paper #095428 :: Chemical Abuse Theories ( 4,025 words; 38 sources; APA )
4. Paper #023572 :: Chemical and Biological Weapons ( 2,400 words; 15 sources; MLA )
5. Paper #100796 :: Chemical and Biological Warfare ( 4,855 words; 9 sources; APA )

About AcaDemon

We have thousands of high-quality term papers, research papers, essays, book reports and dissertations on every topic. At AcaDemon, you can download those term papers to help you write yours! You can be sure that the term paper, essay, book report or research paper, you download are top-quality, competitively priced and high-level work.

Look for more research papers, essays and book reports on Chemical Mechanical Polishing of Copper

This Free Term Paper Abstract is a part of our Term Paper Library. Here you can purchase research papers, examples of essays, academic dissertations, articles, notes, analytical papers, book reports, stories and poems. We have thousands of persuasive, point-of-view, narrative, critical, compare and contrast and other types of essays in our Library. You can also find here Term papers on "Chemical Mechanical Polishing of Copper", Essays on "Chemical Mechanical Polishing of Copper", Research papers on "Chemical Mechanical Polishing of Copper", Student papers on "Chemical Mechanical Polishing of Copper", Book reports on "Chemical Mechanical Polishing of Copper", Dissertation on "Chemical Mechanical Polishing of Copper", Thesis on "Chemical Mechanical Polishing of Copper", Summary of paper on "Chemical Mechanical Polishing of Copper", Articles written on "Chemical Mechanical Polishing of Copper".