Abstract
This paper explains that, in the field of education, school based management (SBM) is considered a major political reform which moves the authority of the budget, personnel and curriculum to the individual schools, creating and empowering the local-site council. The author explains that the classroom management plan (CMP) includes rules of the classroom such as listening to the teacher, obeying the teacher and being kind to others. The paper relates that various online resources and software packages are available that incorporate students working independently, cooperative learning groups and learning centers and make teachers more efficient.

Table of Content
School Based Management (SBM)
Classroom Management Plan
Management of Unacceptable Behavior
Techniques Like
Techniques Reservations
Software
Classroom Rules and Procedures

From the Paper
"In order to enforce the rules it is essential to chalk out a management plan that includes a philosophical statement indicating the beliefs about the classroom management and a description of the teaching style. The management plan should also include a room arrangement plan that puts the resources and infrastructures. The plan should also include the classroom rules, their derivation and communication to students, parents and administrators etc. The plan should also include the classroom procedures and a description of the way it has the objective of fostering and response to the positive students."

Tags:room-arrangement, council, rule, efficiency, political

Abstract
This paper discusses how Chemical Mechanical Planarization (CMP) is one of the most effective methods in achieving adequate local and global surface planarization and how chemical mechanical polishing of copper attracts a lot of interest. It examines the effects of different factors including the slurry, polishing pads and down force etc. on the quality of planarized copper layer in CMP Cu. It also presents, a new CMP copper technique with the name of "Abrasive-free polishing (AFP)".

Outline
Introduction to CMP and CMP Copper(Cu)
Techniques of CMP copper
Removal Mechanism
Slurry-- Chemistry
Slurry Abrasives Particles
Processing Factors
Polishing Pads
Abrasive-Free Polishing of Copper-a New Technique
Conclusions

From the Paper
"Recent years have witnessed the rapid development of using copper (Cu) for low resistivity electrical connections in microelectronic devices.1,2 In fact, copper is one of most commonly used pure metals in the electrical industry because of its low conduct resistivity of about 6-10-8W-m and excellent mechanical properties as well. There are various methods to deposit Cu thin films, for example, electroplating, electroless plating, sputtering and thermal evaporation can be used.3.4 The copper thin films achieved by these techniques, especially those from the electrochemical techniques, are not planar enough to promise a successful multilevel interconnection. However, in fabrication of a logic device with five or more layers, at least one layer should be perfectly planar. Lack of layer planarity may lead to severe problems for photo-lithography (such as insufficient focus depth) and dry etching in sub 0.5 mm 5. Chemical Mechanical Planarization (CMP) is one of the most effective methods in achieving adequate local and global surface planarization.6 Therefore, chemical mechanical polishing of copper attracts a lot of interests in recent years."

Tags:cmp, afp, films, slurry

Abstract
This paper shows that one of the main concerns in Chemical Mechanical Planarization processing is the material removal rate (MRR). The paper also critically reviews the existing MRR models of CMP and compares the assumptions, application aspects and limitations of the two groups? models.

From the Paper
"Chemical Mechanical Planarization (CMP) is the process of surface smoothing and planing by a combination of mechanical action and chemical dissolution. This process is achieved by rubbing a work piece against a polishing pad under load in the presence of chemically active slurry containing an abrasive. CMP is one of the most effective planarization technologies for achieving smaller feature size for the integrated circuit (IC) industry. "

Tags:chemical, material, mechanical, modeling, polishing, rate, removal