Device Isolation of Integrated Circuits

Paper Summary:

This paper states that interconnects and isolation has been, is and will continue to be the key factors that limit the performance and costs of integrated circuits. The author points out that as technology is scaled below a quarter micron, the problems associated with interconnect are ever more pressing and could potentially become the roadblock to progress. This paper concludes that technology is changing the physical size of circuitry, allowing an 11 Million transistors on an 80 mmz die, but this is only a short respite before other technologies allow more and more processing to be done in smaller spaces with less.

Table of Contents
Overview
The Need for Device Isolation Defined
The Evolution in Manufacturing and Deposition Technology
The Evolution in Materials Choice for Device Isolation
A Critical Review of Literature from 1997 through mid-1999
Conclusion

From the Paper:

"Essential to chip fabrication is a process called lithography, which resembles the printing of a photograph by shining light through a negative onto a photosensitive surface. To produce features less than 0.1 mm wide, semiconductor companies face the task of developing methods that involve light or other electromagnetic radiation of wavelengths much shorter than those commonly used today. The shorter the wavelength, the finer the line can be sharply drawn."

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